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Date Posted Description
06/17/09

ARLINGTON, Va., USA – JUNE 15, 2009 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced that Roger Isaac of Silicon Image, Inc. and Karin Werder of Research In Motion were honored with JEDEC Chairman’s Awards. Presented at a quarterly meeting in Montreal, Canada on June 3, 2009 by committee chairman Mian Quddus, these awards honor member volunteers who have made outstanding contributions to their respective committees.

For more information on the MOU, please click here.

06/11/09

ARLINGTON, Va., USA and BEIJING, CHINA – June 11, 2009 – The Chief Representative in China for the JEDEC Solid State Technology Association, Mr.Xianmin Xi, recently delivered a congratulatory speech at the founding ceremony for the China Electronic Standardization Association’s Mobile Storage Standard Committee (CMSSC), held on May 26, 2009 in Beijing.

For more information on the MOU, please click here.

06/02/09

ARLINGTON, Va., USA – JUNE 2, 2009 – JEDEC Solid State Technology Association and the SFF Committee today announced that they have entered into a Memorandum of Understanding (MOU) for the development of joint standards and publications related to solid state drives, with particular emphasis on the development of registered outlines for SSDs.

For more information on the MOU, please click here.

05/19/09

ARLINGTON, Va., USA – MAY 19, 2009 – JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced plans to hold a one-day educational symposium on the recently published JEDEC LPDDR2 standard. Scheduled to coincide with Denali MemCon 2009, the LPDDR2 Symposium will be held be held on Thursday, June 25 at the Hyatt Regency in Santa Clara, CA. For a full agenda and registration for JEDEC’s LPDDR2 Symposium, visit: http://www.jedec.org/Home/trade_events/lpddr/default.htm.

For more information on the symposium, please click here.

05/18/09

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced the publication of registered outline MO-297 for 1.8” Slim Solid State Drives. These types of SSDs have a range of applications in consumer products, including netbooks and laptops. As the first industry standard to target SSDs, MO-297 is indicative of JEDEC’s leadership in setting comprehensive SSD standards. The document is available for free download at www.jedec.org, as part of JEDEC Publication 95: Registered and Standard Outlines for Solid State and Related Products.

For more information on the new standard, please click here.

04/23/09

JEDEC FLASH STORAGE SUMMITS A SUCCESS IN SHANGHAI, TAPIEI AND SAN JOSE Over 800 Attendees Focus on the Future of Flash Memory and Upcoming JEDEC Standards.

For more information on the new standard, please click here.

04/14/09

JEDEC Solid State Technology Association today announced the publication of the JEDEC MMC Version 4.4 standard, available for free download from www.jedec.org. Continuing the evolution of e·MMC™ as an industry leading memory technology, the new standard offers designers enhanced performance and security features. These improvements will enable greater innovation in the design of smart phones, portable GPS units and other portable electronic devices.

For more information on the new standard, please click here.

04/02/09

JEDEC Solid State Technology Association today announced the publication of the JEDEC LPDDR2 Low Power Memory Device Standard, available for free download from www.jedec.org. The new standard is revolutionary in scope, offering:

These features will enhance the design of products such as smart phones, cell phones, PDAs, GPS units, handheld gaming consoles and other mobile devices by enabling increased memory density, improved performance, smaller size, overall reduction in power consumption as well as a longer battery life.

For more information on the new standard, please click here.

03/17/09

JEDEC TO HOST FLASH STORAGE SUMMIT IN SAN JOSE, CA Event to Highlight the Future of Flash Memory.  Please click here for the full press release.

02/19/09

JEDEC Solid State Technology Association announced today that Paul Melville with NXP has been presented with a JEDEC Technical Recognition Award.  Please click here for the full press release.

02/11/09

JEDEC today announced plans for three upcoming Flash Storage Summits to highlight the future of flash memory.  Please click here for the full press release.

JEDEC EVENTS TO HIGHLIGHT THE FUTURE OF FLASH MEMORY
Association to Host Flash Storage Summits in Shanghai, Taipei and San Jose.

01/06/09

JEDEC and IPC Announce Conference on Transitioning to Lead-Free, to be held in Santa Clara, CA from March 2-5, 2009. Please click here for more details.

12/15/08

JEDEC and MIPISM Announce Plans to Collaborate on Universal Storage Solution Specification

JEDEC Solid State Technology Association (JEDEC) and the Mobile Industry Processor Interface (MIPI) Alliance today announced that they have entered into a Memorandum of Understanding (MOU) to evaluate a cooperative working relationship. Under the agreement, JEDEC and MIPI will consider the incorporation of MIPI’s M-PHY specification as the physical layer of JEDEC’s Universal Flash Storage (UFS) specification, currently being developed within the JC-64 Committee on Flash Memory Modules.
12/08/08

Arlington, VA – December 8, 2008 – JEDEC Solid State Technology Association today announced the recipients of its 2008 Chairman’s Awards. Presented at a recent quarterly meeting, these awards honor member volunteers who have made outstanding contributions to their respective committees within the past year.

12/02/08JEDEC Announces Partner Programs at CES, January 8th 2009 in Las Vegas, Nevada

Industry Leaders to Speak on the Future of Flash Memory in Consumer Products and Lead-Free Electronics Assembly

The JEDEC Solid State Technology Association (JEDEC) today announced its participation in the 2009 International Consumer Electronics Show (CES) in Las Vegas, Nevada, on January 8. CES, produced by the Consumer Electronics Association, is the preeminent showcase for the worldwide consumer electronics industry. JEDEC is the leading developer of standards for the microelectronics industry, which are essential to the advancement of consumer electronics technology. JEDEC will present two CES Partner Programs: The Future of Flash Memory in Consumer Products and a tutorial on Lead-Free Assembly Classification and Handling.

Speakers from Intel, Micron, Microsoft, Nokia, Qualcomm, Seagate and Samsung will present.

11/17/08JEDEC, the global leader in standards development for the microelectronics industry, is inviting companies worldwide to participate in standards development work being conducted by JEDEC's JC-64.8 subcommittee for Solid State Drives.

For more information, including quotes from leading industry companies, please click here.
10/20/08IPC and JEDEC Announce International Conference Offering Solutions to Challenges Posed by Lead-Free Electronics Manufacturing

JEDEC Solid State Technology Association and IPC - Association Connecting Electronics Industries today announce an International Conference on Lead-Free Electronics. To be held December 8-10, 2008 at the Fairmont Hotel in Dallas, Texas, the event will feature a full-day technical conference with an outstanding roster of speakers, as well as two full days of informative half-day workshops.

"The electronics industry is in the midst of one the largest changes that has occurred over the last 50 years. The migration to lead-free materials has resulted in a significant shift in the way the industry perceives reliability. It is critical for engineers and technical managers to stay informed of latest developments with respect to performance of lead-free assemblies," said David Torp, IPC vice president of standards and technology.

For more information, please see the attached press release.
10/14/08JEDEC and ESD Association Announce Collaboration on Standards Development for Unified Electrostatic Discharge Test Methods
JEDEC Solid State Technology Association and the ESD Association today (10/13/08) announced that they have entered into a Memorandum of Understanding (MOU) agreement for the development of joint standards and publications in the field of device electrostatic discharge (ESD) sensitivity testing.
Electrostatic discharge can significantly impair the reliability and operation of solid state devices, and test methodologies are becoming ever more critical to the industry as technology advances and device complexity increases. Both JEDEC and ESDA believe this combined effort to develop unified test methods for ESD will be welcome news to an industry confused by the various ESD test standards currently available.
10/01/08 JEDEC Solid State Technology Association (JEDEC) and MindShare, a premier resource for technology education, today announced that they have entered into an agreement to collaborate on the development of educational resources related to JEDEC standards. MindShare’s unique expertise in technical training combined with JEDEC members’ in-depth knowledge of standards and the development process will result in exceptional opportunities for industry participants to learn about JEDEC standards
09/26/08 JEDEC Solid State Technology Association Announces 50th Anniversary – Celebrating 50 Years of Standards Innovation

Fifty years ago, on Friday, September 26, 1958 at 9:30AM, the first meeting of the Semiconductor Device Council of the Joint Electron Device Engineering Council (JEDEC) was held at the Williamsburg Inn in Williamsburg, Virginia, chaired by Virgil M. Graham of the Electronic Industries Association (EIA). Representatives from a veritable who’s who of prominent electronics and communications companies of the day were in attendance, including Texas Instruments, Bell Telephone Laboratories, General Electric Company, and Radio Corporation of America, among many others.

09/23/08 MultiMediaCard Association (MMCA) and JEDEC Solid State Technology Association (JEDEC) today announced plans to merge certain MMCA assets, including embedded MMC (e-MMC) and miCARD specifications, trademarks and Intellectual Property rights, into JEDEC effective September 22, 2008. The merger follows a successful partnership forged during the development of the e-MMCv4.2 and v4.3 specifications.
07/17/08 JEDEC announces the formation of the JC-64.8 Subcommittee for Solid State Drives (SSD) to develop standards for solid state drives used for embedded or removable memory storage leveraging the existing storage infrastructure.
06/17/08 Improvements in silicon production processes have enabled a reduction in the core and I/O voltage for an incremental improvement in DDR3. Called “DDR3L” for Low Voltage, the new devices will operate from a single 1.35V rail, compared to the 1.5V of existing devices, resulting in a power savings of 20% in many mainstream applications. As many computing systems work to meet growing demand for green technologies, this savings is a breath of fresh air. See attached press release for more details.
05/30/08 JEDEC and The Open NAND Flash Interface Workgroup (ONFi) announced today that they have entered into a collaborative agreement under which they will work together to develop NAND flash specification(s). ONFi is submitting the ONFi 2.0 specification as part of this joint effort. The goal of this joint activity will be to unify the industry and develop a standard which is backward compatible with existing flash interface technologies, including ONFi 2.0, to the extent technically feasible.
See the attached for additional details.
05/29/08

JEDEC has announced the opening of an office in Beijing, China as of May 2, 2008.  The JEDEC office is co-located with the China office of the Consumer Electronics Association (CEA). 

The head of the JEDEC office and JEDEC's chief representative in China is Xianmin Xi.  Mr. Xi previously worked with the U.S. Information Technology Organization (USITO).  Prior to USITO, Mr. Xi spent 10 years as an information technology specialist with the Commercial Service of the U.S. Embassy in Beijing.  See attached release for additional details.
01/30/08 NEW EMBEDDED MMC V4.3 SPECIFICATION NOW AVAILABLE WITH POWER-ON
BOOT AND ENERGY SAVING FEATURES
11/29/07

JEDEC recently published the Low Power Double Data Rate (LPDDR) Non-Volatile Memory (NVM) Specification for Flash memory chips. For the first time, SDRAM and NVM traffic can be interleaved efficiently on a shared bus without arbitration, to reduce cost and dramatically improve performance in mobile devices.
11/16/07

The Electronic Industries Alliance (EIA), the JEDEC Solid State Technology Association (JEDEC), and the Japan Green Procurement Survey Standardization Initiative (JGPSSI) have revised the tool that provides businesses across the supply chain with more reliable information on the regulated materials contained in electronic products and components.  See the attached release for details.
11/16/07 Altera Corporation announced its quality and reliability department was presented with the JEDEC Technical Recognition Award. The company received this award for its ongoing contributions to help JEDEC develop and improve standards in the areas of second-level reliability, high-temperature package warpage, HBM ESD testing and marking permanency.
9/05/07

Temperatures are running hot in the computing industry as engineers struggle with rising thermal profiles for computer memory while form factors are getting ever smaller.  JEDEC has given some relief to system designers with committee approval of the TSE2002 Serial Presence Detect (SPD) with Thermal Sensor.  The approved specification is expected to be available by mid-November 2007.

The TSE2002 device incorporates the standard functions of the SPD, an EEPROM found on all JEDEC reference designs to make the module configuration and performance specifications readable over an SMBus, with a thermal sensing function accurate to within a half degree Celsius.  It is pin compatible with the standard EE1002 SPD and can be incorporated immediately into existing module designs.
8/29/07

Today, JEDEC has announced that it has initiated standardization for the Solid State Drive (SSD) segment of the computer industry.  This nascent market is poised for explosive growth as the price gap between rotating media hard disks and non-volatile alternatives such as flash drives decreases.  See attached release for details.
8/29/07

The JEDEC Solid State Technology Association (JEDEC) today announced that it has begun work on a next-generation card/embedded specification that will support higher performance and greater efficiencies when flash memory is used in consumer electronics and PCs. The new specification, Universal Flash Storage (UFS), will become an industry-wide interface standard encompassing all removable flash cards and embedded memory that supports booting as well as host system input and output interfaces.  
8/27/07 DDR2 SO-DIMM - REVISION 2.3 RELEASED
8/21/07 JEDEC Standardization Meeting - Munich, Germany
06/27/07

Participation of JEDEC in the upcoming MemCon event in San Jose, California, on July 17-19, 2007.
06/26/07

PUBLICATION OF JEDEC DDR3 SDRAM STANDARD

Arlington, VA - June 26, 2007 - The JEDEC Solid State Technology Association announced today that it has completed development and publication of the DDR3 (Double Data Rate 3) memory device standard, which can now be found and downloaded at no charge from the JEDEC website (www.jedec.org).
05/18/07 Arlington, VA May 18, 2007. The JC-11.14 Subcommittee of JEDEC announced
today the publication of SO-009 Issue A covering a common SMT footprint for DDR2
DIMM sockets which was approved for publication at the JC-11 Committee Meeting that
was held in January 2007 in San Antonio, TX.
04/30/07

Arlington, VA - April 30, 2007 - JEDEC presented its first international awards of distinction to two senior officials of the China Semiconductor Industry Association (CSIA) at a ceremony in Beijing, China.

See Picture of the ceremony

04/07/07 JEDEC press release on the formation of the new JC-45.5 Module Interconnect Subcommittee
04/04/07

JEDEC Elects HP Representative to Join Board of Directors

Arlington, VA – March 28, 2007 – JEDEC Board of Directors today announced its decision to elect Belal Gharaibeh, corporate procurement engineer at HP, to serve as representative on its board.

02/20/07

JEDEC Adopts DDR2 32b SO-DIMM Design Specification
02/20/07

JEDEC Adopts Definitions of EE1002 and EE1002A Serial Presence Detect EEPROM
12/20/06

MultiMediaCard Association (MMCA) and the JEDEC Solid State Technology Association (JEDEC) Announce eMMC™ for Embedded Flash Memory Applications
05/16/06 Position statement from JEDEC on "Enhanced Performance Profiles" ("EPP").
05/09/06 JEDEC Press Release on the Adoption of an FB-DIMM Specification
05/09/06 JEDEC/IPC Press Release on a Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline.
03/08/2006 MultiMediaCard Association and JEDEC Collaborate on MMC Standardization
12/07/2005 RFID Press Release.
6/13/05 Services held for Martin "Marty" Freedman.
6/9/05
JEDEC AND CEA COSPONSOR DISCOVERY GROUP MEETING ON RFID
5/25/05 JEDEC ANNOUNCES A NEW STANDARD ON TEST METHOD FOR MEASURING
WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES
4/5/05 JEDEC and CESI SIGN AGREEMENT to Translate JEDEC Standards into Chinese
5/7/04

RF/BB standard JESD96 that was released on 5/4/04
11/15/03 Newly (re-)elected JEDEC Board Members:
Bird Lycoudes Freedman
9/16/03 JEDEC Publishes DDR 2 Standard
07/01/03 JEDEC JC-40 Committee, validation
04/07/03 JEDEC informs consumers to be careful when selecting and purchasing memory modules
04/01/03 JEDEC Announces a certification process and branding. It was the consensus of the Board members not to pursue this proposal (JCB-03-88), Feb 2004.
12/11/02 JEDEX Conference in San Jose
10-29-02 IPC JEDEC lead free see http://www.pb-free.org
9/27/02 FSA and JEDEC Release Foundry Process Qualification Guideline JP-001
08/20/02
07/17/02
06/28/02
04/02/02 JEDEC Announces New Wireless LAN Committee
01/23/02 Jim Hayward receives JEDEC award of excellence
01/23/02 DY Lee receives JEDEC Technical Recognition Award
11/15/01 Lead Free
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